| US 7,602,071 B2 | ||
| Apparatus for dividing an adhesive film mounted on a wafer | ||
| Naoki Ohmiya, Tokyo (Japan); Kentaro Iizuka, Tokyo (Japan); and Yusuke Nagai, Tokyo (Japan) | ||
| Assigned to Disco Corporation, Tokyo (Japan) | ||
| Filed on Jul. 28, 2005, as Appl. No. 11/190,966. | ||
| Claims priority of application No. 2004-228809 (JP), filed on Aug. 05, 2004. | ||
| Prior Publication US 2006/0030129 A1, Feb. 09, 2006 | ||
| Int. Cl. H01L 23/28 (2006.01) | ||
| U.S. Cl. 257—787 [257/620; 257/E23.078; 156/349] | 4 Claims |
| 1. An apparatus for dividing an adhesive film mounted on the back surface of a wafer, along a plurality of streets formed
on the wafer front surface in a lattice pattern with function elements formed in a plurality of areas sectioned by the plurality
of streets, the wafer with the adhesive film being on a surface of a protective tape mounted on an annular frame, the apparatus
comprising:
a frame holding means for holding the annular frame with the protective tape mounted thereon;
a cooling means for cooling the adhesive film through the protective tape to thereby reduce stretchability of the film; and
a tape expanding means for expanding the protective tape mounted on the annular frame and thereby divide the cooled adhesive
film having reduced stretchability so as to separate the adhesive film into individual pieces corresponding to the function
elements.
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