| US 7,602,017 B2 | ||
| Short channel LV, MV, and HV CMOS devices | ||
| Jun Cai, Scarborough, Me. (US) | ||
| Assigned to Fairchild Semiconductor Corporation, South Portland, Me. (US) | ||
| Filed on Mar. 13, 2007, as Appl. No. 11/685,364. | ||
| Prior Publication US 2008/0224210 A1, Sep. 18, 2008 | ||
| Int. Cl. H01L 29/36 (2006.01) | ||
| U.S. Cl. 257—335 [257/376; 257/E29.063] | 21 Claims |

| 1. An N channel MOSFET (NMOS) comprising:
a) a P− epitaxial layer on a substrate;
b) a source and a drain formed in said epitaxial layer and located on opposite sides of a gate lying on a gate which lies
on said epitaxial layer;
c) a first N type upper buffer layer extending from under said source laterally to a position between a first edge of said
gate closest to said source at a top surface of said epitaxial layer and a middle of said gate;
d) a second N type upper buffer layer extending from under said drain laterally to a position between a second edge of said
gate closest to said drain at said top surface of said epitaxial layer and said middle of said gate;
e) a first P type lower bulk layer extending from under said first N type buffer layer laterally to a position under said
gate at said top surface of said epitaxial layer which is closer to said drain than to said source; and
f) a second P type lower bulk layer extending from under said second N type buffer layer laterally to a position under said
gate at said top surface of said epitaxial layer which is closer to said source than to said drain, said first and second
P type bulk layers overlying each other in a region under said gate.
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