| US 7,601,934 B2 | ||
| Integrated thermal unit having a shuttle with a temperature controlled surface | ||
| David H. Quach, San Jose, Calif. (US); and Martin Jeff Salinas, San Jose, Calif. (US) | ||
| Assigned to Sokudo Co., Ltd., Kyoto (Japan) | ||
| Filed on Oct. 05, 2007, as Appl. No. 11/868,453. | ||
| Application 11/868453 is a continuation of application No. 11/174988, filed on Jul. 05, 2005, granted, now 7,282,675. | ||
| Claims priority of provisional application 60/639109, filed on Dec. 22, 2004. | ||
| Prior Publication US 2008/0023656 A1, Jan. 31, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H05B 3/68 (2006.01); C23C 16/00 (2006.01) | ||
| U.S. Cl. 219—444.1 [118/724] | 20 Claims |
| 1. A processing unit disposed in a track lithography tool, the processing unit comprising:
a stack of two or more vertically arranged integrated thermal units, each of the integrated thermal units comprising:
a bake plate configured to heat a substrate supported above a surface of the bake plate;
a chill plate configured to cool a substrate supported above a surface of the chill plate;
a substrate transfer station configured to:
transfer a substrate into the integrated thermal unit; and
place the substrate onto a substrate transfer shuttle configured to transfer the substrate between the substrate transfer
station, the bake plate, and the chill plate, the substrate transfer shuttle having a temperature controlled substrate holding
surface that is capable of cooling the substrate; and
a housing within which the bake plate, the chill plate, and the substrate transfer station are enclosed, wherein the bake
plate, the chill plate, and the substrate transfer station are arranged linearly along a length of the housing with the chill
plate positioned between the bake plate and the substrate transfer station, wherein a first integrated thermal unit of the
two or more integrated thermal units comprises a first bake plate paired with a first chill plate and a second integrated
thermal unit of the two or more integrated thermal units comprises a second bake plate paired with a second chill plate.
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