US 7,601,482 B2
Negative photoresist compositions
Georg Pawlowski, Bridgewater, N.J. (US); Chunwei Chen, Piscataway, N.J. (US); Joseph Oberlander, Phillipsburg, N.J. (US); and Robert Plass, Belleville, N.J. (US)
Assigned to AZ Electronic Materials USA Corp., Somerville, N.J. (US)
Filed on Mar. 28, 2006, as Appl. No. 11/390,716.
Prior Publication US 2007/0231735 A1, Oct. 04, 2007
Int. Cl. G03F 7/033 (2006.01); G03F 7/028 (2006.01); G03F 7/031 (2006.01); G03F 7/30 (2006.01)
U.S. Cl. 430—285.1  [430/325; 430/905; 430/910; 430/916; 430/914] 23 Claims
 
1. A negative photoresist composition comprising;
a) at least one alkali-soluble polymer, where the polymer comprises at least one unit of structure 1,

OG Complex Work Unit Drawing
 where, R′ is selected independently from hydrogen, (C1-C4)alkyl, chlorine and bromine, and m is an integer from 1 to 4;
b) at least one monomer of structure 4;

OG Complex Work Unit Drawing
 where, W is a multivalent linking group, R1 to R6 are independently selected from hydrogen, hydroxy, (C1-C20) alkyl and chlorine, X1 and X2 are independently oxygen and n is an integer equal to or greater than 1; and,
c) at least one photoinitiator,
 and, further where the monomer of structure 4 comprises an acid-cleavable group and the alkali-soluble polymer further comprises an acid-cleavable group.