| US 7,601,419 B2 | ||
| Printed circuit board and method of manufacturing the same | ||
| Jong Seok Song, Seoul (Korea, Republic of); and Taehoon Kim, Gyeonggi-do (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon (Korea, Republic of) | ||
| Filed on Oct. 24, 2006, as Appl. No. 11/585,276. | ||
| Claims priority of application No. 10-2005-0125249 (KR), filed on Dec. 19, 2005; and application No. 10-2006-0063370 (KR), filed on Jul. 06, 2006. | ||
| Prior Publication US 2007/0141310 A1, Jun. 21, 2007 | ||
| Int. Cl. B32B 15/00 (2006.01) | ||
| U.S. Cl. 428—209 [174/257; 174/258; 174/259; 361/750; 361/751] | 5 Claims |
| 1. A printed circuit board, comprising:
a resin substrate for the printed circuit board;
a fluorine resin coating layer formed on at least one surface of the resin substrate;
a via hole formed in a predetermined position of the substrate coated with the fluorine resin;
a copper seed layer formed on a surface of the substrate having the via hole through ion beam surface treatment and vacuum
deposition; and
a copper pattern plating layer formed on part of the substrate having the copper seed layer and formed in the via hole.
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