US 7,601,271 B2
	Process and equipment for bonding by molecular adhesion
Sebastien Kerdiles, Saint-Ismier (France); Carine Duret, Grenoble (France); Alexandre Vaufredaz, Voiron (France); and Frédéric Metral, St. Quentin sur Isère (France)
Assigned to S.O.I.Tec Silicon on Insulator Technologies, Bernin (France)
Filed on Feb. 17, 2006, as Appl. No. 11/357,771.
Claims priority of application No. 05 12008 (FR), filed on Nov. 28, 2005; and application No. 05 12009 (FR), filed on Nov. 28, 2005.
Prior Publication US 2007/0119812 A1, May 31, 2007
Int. Cl. C03C 15/00 (2006.01); B31B 1/60 (2006.01)

U.S. Cl. 216—34  [156/60; 257/E21.122]

23 Claims

1. A method for bonding two substrates together by molecular adhesion of their surfaces which comprises: preparing the surfaces of the substrates with a flatness sufficient to facilitate bonding by propagation of a bonding front when the surfaces of the substrates are placed in contact with each other, modifying the surface of one or both of the substrates sufficiently to regulate propagation speed of the bonding front to reduce bubble or voids between the substrates after bonding, wherein the bonding front has a speed of above 0.6 and below 2 cm/s.