| US 7,600,993 B2 | ||
| Method and apparatus for pattern transfer, and annular recording medium | ||
| Hideaki Kataho, Kanagawa (Japan); Hiroshi Okada, Kanagawa (Japan); Kenya Wada, Tokyo (Japan); and Hisayoshi Ichikawa, Tokyo (Japan) | ||
| Assigned to Hitachi High-Technologies Corporation, Tokyo (Japan) | ||
| Filed on Aug. 17, 2007, as Appl. No. 11/840,280. | ||
| Claims priority of application No. 2006-224248 (JP), filed on Aug. 21, 2006. | ||
| Prior Publication US 2008/0075908 A1, Mar. 27, 2008 | ||
| Int. Cl. B29C 59/00 (2006.01); B29D 17/00 (2006.01) | ||
| U.S. Cl. 425—385 [425/810; 101/408; 101/474] | 4 Claims |
| 1. An apparatus for transferring a pattern of minute structures by the use of a pair of press members located opposingly for
movements toward and away from each other, one press member being adapted to support thereon a mold having on a transfer surface
a master pattern of minute structures to be transferred, and the other press member being adapted to support thereon an annular
substrate plate having a curable resin layer coated thereon and to press said resin layer against said transfer surface of
said mold to transfer said minute structures thereto, characterized in that:
said mold is provided with a center hole defining at least three small-diameter segments and three large-diameter segments
alternately along an inner periphery of said transfer mold;
said annular substrate plate is so formed as to have an inside diameter exactly matching with said small-diameter segments
at the inner periphery of said mold; and
a chuck mechanism is provided inside of said other press member, said chuck mechanism having at least three chuck pawls located
in spaced positions along an inner periphery of said substrate plate, said chuck pawls being radially displaceable to take
either an operative position in abutting engagement with said inner periphery of said substrate plate or a receded position
disengaged from said substrate plate;
said chuck pawls of said chuck mechanism being adapted to grip both of said inner periphery of said substrate and said small-diameter
segments of said center hole of said mold at the time of setting said substrate plate in aligned position relative to said
mold, and to grip said inner periphery of said substrate plate alone, at a spaced position from a large-diameter segment of
said center hole of said mold, at the time of separating said substrate plate from said mold.
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