| US 7,600,310 B2 | ||
| Method of head stack assembly flexible circuit assembly attached to an actuator arm | ||
| Yiu Sing Ho, Ma On Shan Shatin (Hong Kong Special Administrative Region of the People's Republic of China, The); Hiroshi Fukaya, Tai Koo Shing (Hong Kong Special Administrative Region of the People's Republic of China, The); Kam Fung Yip, Tuen Mun (Hong Kong Special Administrative Region of the People's Republic of China, The); Satoshi Yamaguchi, Kowloon (Hong Kong Special Administrative Region of the People's Republic of China, The); Jeffery L. Wang, Tai Po (Hong Kong Special Administrative Region of the People's Republic of China, The); and Can Hua Chen, Dongguan (China) | ||
| Assigned to SAE Magnetics (H.K.) Lts., Shatin, N.T. (Hong Kong Special Administrative Region of the People's Republic of China, The) | ||
| Filed on Jun. 16, 2006, as Appl. No. 11/454,599. | ||
| Application 11/454599 is a division of application No. 10/753911, filed on Jan. 07, 2004. | ||
| Prior Publication US 2006/0232890 A1, Oct. 19, 2006 | ||
| Int. Cl. H05K 1/00 (2006.01); G11B 21/00 (2006.01) | ||
| U.S. Cl. 29—603.03 [360/264.2; 439/67] | 6 Claims |

| 1. A method, comprising:
electrically coupling a slider to at least one actuator pad with a flexible circuit substrate; and
mounting the flexible circuit substrate to an actuator arm with a stiffener between the flexible circuit substrate and the
actuator arm, wherein the stiffener is mounted to the actuator arm by soldering at least one pin extending from the actuator
arm through the stiffener and the flexible substrate and wherein the at least one pin extends in direct contact with the stiffener
and the flexible substrate.
|