| US 7,432,530 B2 | ||
| Solid-state imaging device and method of manufacturing same | ||
| Atsuko Yamashita, Kanagawa-ken (Japan); Toshihiko Kitamura, Kanagawa-ken (Japan); Takashi Doi, Kanagawa-ken (Japan); Masaaki Ogawa, Kanagawa-ken (Japan); and Takayuki Sakai, Tokyo (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on May 22, 2007, as Appl. No. 11/751,807. | ||
| Claims priority of application No. 2006-145495 (JP), filed on May 25, 2006. | ||
| Prior Publication US 2007/0275496 A1, Nov. 29, 2007 | ||
| Int. Cl. H01L 29/04 (2006.01); H01L 29/15 (2006.01); H01L 31/036 (2006.01); H01L 29/10 (2006.01); H01L 31/0376 (2006.01); H01L 31/20 (2006.01); H01L 31/062 (2006.01); H01L 31/113 (2006.01); H01L 31/06 (2006.01); H01L 27/148 (2006.01); H01L 29/74 (2006.01); H01L 29/768 (2006.01) | ||
| U.S. Cl. 257—72 [257/59; 257/222; 257/223; 257/291; 257/292; 257/293; 257/294; 257/461; 257/462] | 14 Claims |
| 1. A solid-state imaging device comprising:
a substrate;
a photo-receiving portion formed in the substrate;
a wiring layer formed on the substrate and having a trench being formed on a region directly above the photo-receiving portion;
and
a light guiding member provided in the trench and made of organic material,
an empty space being formed between a side wall of the trench and a side surface of the light guiding member, and
the side surface of the light guiding member being curved so that a central part of the side surface along a vertical direction
is closer to a center axis of the trench than both end parts of the side surface along the vertical direction.
|