	US 7,599,184 B2
	Liquid cooling loops for server applications
Girish Upadhya, Cupertino, Calif. (US); Mark Munch, Los Alos Hills, Calif. (US); Norman Chow, Milpitas, Calif. (US); Paul Tsao, Los Altos, Calif. (US); Douglas E. Werner, Santa Clara, Calif. (US); Mark McMaster, Menlo Park, Calif. (US); Frederic Landry, San Francisco, Calif. (US); Ian Spearing, Westerville, Ohio (US); and Tim Schrader, Irwin, Ohio (US)
Assigned to Cooligy Inc., Mountain View, Calif. (US)
Filed on Feb. 16, 2007, as Appl. No. 11/707,350.
Claims priority of provisional application 60/774764, filed on Feb. 16, 2006.
Prior Publication US 2007/0201204 A1, Aug. 30, 2007
Int. Cl. H05K 7/20 (2006.01)

U.S. Cl. 361—699 [361/695; 361/704; 361/727; 165/80.4; 165/104.33; 174/15.1]

54 Claims

1. A cooling system for cooling a plurality of electronics servers, the cooling system comprising:

a. a plurality of electronics servers, each electronics server including one or more heat generating devices;

b. a plurality of fluid based cooling systems, one fluid based cooling system thermally coupled to a corresponding electronics server, wherein each fluid based cooling system includes at least one heat exchanging device through which flows a first fluid to receive heat transferred from the one or more heat generating devices of the corresponding electronics server, and each fluid based cooling system further includes a heat rejector through which the first fluid flows to transfer heat from the first fluid to the heat rejector;

c. a second heat exchanging system including a single cold plate through which flows a second fluid separate from the first fluid and a liquid-to-air heat rejector; and

d. a thermal interface formed between the heat rejector of each of the plurality of fluid based cooling systems and the single cold plate of the second heat exchanging system to transfer heat from the first fluid to the second fluid,

wherein each of the plurality of electronics servers is configured to be inserted along an insertion vector into an electronics chassis, and wherein the thermal interface is disposed along a thermal interface plane that is non-perpendicular to the insertion vector.