| US 7,598,607 B2 | ||
| Semiconductor packages with enhanced joint reliability and methods of fabricating the same | ||
| Hyun-Soo Chung, Gyeonggi-do (Korea, Republic of); Dong-Hyeon Jang, Gyeonggi-do (Korea, Republic of); Nam-Seog Kim, Gyeonggi-do (Korea, Republic of); and Sun-Won Kang, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do (Korea, Republic of) | ||
| Filed on May 19, 2008, as Appl. No. 12/123,367. | ||
| Claims priority of application No. 10-2007-0049766 (KR), filed on May 22, 2007. | ||
| Prior Publication US 2008/0290492 A1, Nov. 27, 2008 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—686 [257/777] | 14 Claims |
| 1. A semiconductor package comprising:
a substrate; and
at least one package unit disposed on the substrate, the package unit including:
a semiconductor chip having a pad;
a bottom layer disposed below the semiconductor chip;
a top layer disposed on the semiconductor chip, the bottom layer and the top layer substantially surrounding the semiconductor
chip; and
a redistribution structure overlying the top layer, the redistribution structure electrically connected to the pad,
wherein the top layer and the bottom layer each comprise a material having a lower modulus than the redistribution structure
and the semiconductor chip.
|