| US 7,597,232 B2 | ||
| Apparatus for applying conductive paste onto electronic component | ||
| Jae Taek Kim, Busan (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-Do (Korea, Republic of) | ||
| Filed on Aug. 31, 2006, as Appl. No. 11/513,219. | ||
| Claims priority of application No. 10-2005-0085722 (KR), filed on Sep. 14, 2005. | ||
| Prior Publication US 2007/0057385 A1, Mar. 15, 2007 | ||
| Int. Cl. B23K 1/00 (2006.01); B23P 19/00 (2006.01) | ||
| U.S. Cl. 228—6.2 [29/745; 29/746; 29/747; 225/45] | 6 Claims |
| 1. An apparatus for applying a conductive paste onto an electronic component comprising:
a first jig unit provided with paste holes, which are filled with the conductive paste; and
a second jig unit being movable and provided with extruding pins, which are inserted into the paste holes of the first jig
unit, for allowing the conductive paste to be applied onto the electronic component,
wherein an interval between one surface of the first jig unit contacting the electronic component and the upper surface of
each of the extruding pins of the second jig unit inserted into the paste holes is varied according to the amount of the conductive
paste applied onto the electronic component.
|