| US 7,597,133 B2 | ||
| Heat dissipation device with heat pipes | ||
| Hsieh-Kun Lee, Guangdong (China); Cheng-Tien Lai, Guangdong (China); Zhi-Bin Tan, Guangdong (China); Zhi-Yong Zhou, Guangdong (China); and Jiang-Jian Wen, Guangdong (China) | ||
| Assigned to Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
| Filed on Dec. 25, 2005, as Appl. No. 11/306,359. | ||
| Prior Publication US 2007/0144709 A1, Jun. 28, 2007 | ||
| Int. Cl. F28F 7/00 (2006.01) | ||
| U.S. Cl. 165—80.3 | 17 Claims |
| 1. A heat dissipation device comprising:
a base having a first face and a second face opposite to the first face;
a fin set comprising a plurality of fins arranged on the first face of the base;
a first heat pipe having a first section positioned to and thermally connecting with the second face of the base; and
a second heat pipe having a first section positioned to and thermally connecting with the first face of the base and substantially
perpendicular to the first section of the first heat pipe;
wherein a protrusion extends from the second face of the base, and wherein the first section of the first heat pipe is combined
to and thermally connects with the protrusion; and
wherein the protrusion of the base has a groove extending therethrough, and the first section of the first heat pipe is received
in the groove.
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