| US 7,596,421 B2 | ||
| Process control system, process control method, and method of manufacturing electronic apparatus | ||
| Junji Sugamoto, Yokosuka (Japan); Yukihiro Ushiku, Yokohama (Japan); Kazutaka Akiyama, Matsudo (Japan); and Shoichi Harakawa, Yokohama (Japan) | ||
| Assigned to Kabushik Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jun. 21, 2006, as Appl. No. 11/471,675. | ||
| Claims priority of application No. 2005-180659 (JP), filed on Jun. 21, 2005; and application No. 2005-272019 (JP), filed on Sep. 20, 2005. | ||
| Prior Publication US 2006/0287754 A1, Dec. 21, 2006 | ||
| Int. Cl. G06F 19/00 (2006.01) | ||
| U.S. Cl. 700—121 [700/109; 700/108] | 11 Claims |
| 1. A process control system comprising:
a monitor unit which monitors apparatus information indicating a processing state of a manufacturing apparatus;
an apparatus information collection unit which collects a monitored value of the apparatus information from the monitor unit
in operation of a manufacturing process;
a correlation preparation unit which prepares a correlation between a test monitored value of the apparatus information in
a test manufacturing process with respect to a test wafer, and a feature quantity obtained from a processing parameter for
controlling the manufacturing apparatus and a finished form in the test manufacturing process;
a process management unit which calculates a setting value of the processing parameter in an objective manufacturing process
on the basis of at least one of a plurality of estimated values of the feature quantity in combination with a dimension of
a processing objective structure in the objective manufacturing process with respect to an objective wafer, said plurality
of estimated values being calculated, on the basis of the correlation prepared by the correlation preparation unit, with respect
to a plurality of reference monitored values of the apparatus information except for abnormal values in a distribution of
said plurality of reference monitored values in a reference manufacturing process with respect to a plurality of reference
wafers; and
an apparatus control unit which controls the manufacturing apparatus in accordance with a processing recipe in which the setting
value is described in a processing step in the objective manufacturing process,
wherein the process management unit determines abnormal values in a distribution of said plurality of reference monitored
values; classifies abnormal values which are reproduced by an appearance distribution region among the abnormal values determined
in the distribution of the reference monitored values into an abnormal mode; and prepares a new correlation between the abnormal
value of a first abnormal wafer classified into the abnormal mode, and a feature quantity calculated on the basis of a finished
form of the first abnormal wafer.
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