| US 7,595,997 B2 | ||
| Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component | ||
| Masato Nomiya, Moriyama (Japan); Norio Sakai, Moriyama (Japan); and Mitsuyoshi Nishide, Yasu (Japan) | ||
| Assigned to Murata Manufacturing Co., Ltd., Kyoto (Japan) | ||
| Filed on Jul. 01, 2008, as Appl. No. 12/165,700. | ||
| Application 12/165700 is a continuation of application No. PCT/JP2006/325805, filed on Dec. 25, 2006. | ||
| Claims priority of application No. 2006-037105 (JP), filed on Feb. 14, 2006; and application No. 2006-122595 (JP), filed on Apr. 26, 2006. | ||
| Prior Publication US 2008/0261005 A1, Oct. 23, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H05K 1/14 (2006.01); H01L 23/48 (2006.01) | ||
| U.S. Cl. 361—742 [361/736; 361/743; 361/746; 361/760; 361/770; 257/700; 257/701; 257/778; 257/779] | 11 Claims |
| 1. A multilayer ceramic electronic component comprising:
a multilayer ceramic body including a ceramic base material layer and a shrinkage-inhibiting layer arranged to suppress shrinkage
stacked in a planar direction of the ceramic base material layer and a conductor pattern;
a pedestal portion arranged on a region of a first main surface of the multilayer ceramic body and including a non-metallic
inorganic powder and a resin such that the pedestal portion is fixed to the first main surface with at least the resin;
a via hole conductor arranged in the pedestal portion so that one end surface of the via hole conductor is exposed in a surface
of the pedestal portion; and
a surface mounting-type electronic component connected, through a conductive binder, to the one end surface of the via hole
conductor exposed in the surface of the pedestal portion.
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