| US 7,595,992 B2 | ||
| Substrate unit, cooling device, and electronic device | ||
| Yuuichi Koga, Hachioji (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Feb. 01, 2007, as Appl. No. 11/701,251. | ||
| Claims priority of application No. 2006-051960 (JP), filed on Feb. 28, 2006. | ||
| Prior Publication US 2007/0200190 A1, Aug. 30, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—719 [361/679.47; 361/679.52; 361/700; 361/704; 174/15.1; 174/15.2; 165/80.3; 165/80.4; 165/104.33] | 20 Claims |
| 1. A substrate unit, comprising:
a first substrate having a first substrate main body and a circuit component;
a second substrate having a second substrate main body, an opening portion provided at the second substrate main body, and
a cooling member cooling the circuit component; and
a coupling member coupling the first substrate and the second substrate to allow the first substrate and the second substrate
to be opposite to each other,
the circuit component being mounted on a face of the first substrate main body which is opposite to the second substrate,
the second substrate main body having a first face which is opposite to the first substrate, and a second face which is opposite
to the first face,
the cooling member having a main body and a projecting portion which projects from the main body, and
the coupling member fixing the main body of the cooling member to the second face of the second substrate main body, and coupling
the first substrate and the second substrate so as to fit the projecting portion of the cooling member in the opening portion
and press the projecting portion thereof against the circuit component.
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