| US 7,595,988 B2 | ||
| Thermal management system and method for electronic assemblies | ||
| James S. Wilson, Hurst, Tex. (US); and Michael A. Moore, Ft. Worth, Tex. (US) | ||
| Assigned to Raytheon Company, Waltham, Mass. (US) | ||
| Filed on Nov. 06, 2007, as Appl. No. 11/935,496. | ||
| Application 11/935496 is a continuation of application No. 11/039212, filed on Jan. 19, 2005, granted, now 7,292,439, filed on Nov. 06, 2007. | ||
| Prior Publication US 2008/0062650 A1, Mar. 13, 2008 | ||
| Int. Cl. H05K 7/20 (2006.01); F28F 7/00 (2006.01) | ||
| U.S. Cl. 361—700 [165/80.4; 165/104.33; 165/185; 361/699; 361/702] | 20 Claims |
| 1. A thermal management system for an electronic assembly, comprising:
an electronic component coupled to a substrate at an underside of the electronic component;
the substrate coupled to a coldplate;
a spring member disposed between and engaging both the underside of the electronic component and the coldplate; and
a heat transfer element disposed within a chamber formed by the spring member.
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