| US 7,595,885 B2 | ||
| Process monitoring system, process monitoring method, and method for manufacturing semiconductor device | ||
| Takayuki Sakai, Tokyo (Japan); Masanobu Kibe, Kanagawa (Japan); and Tokuhisa Ohiwa, Kanagawa (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jan. 31, 2008, as Appl. No. 12/10,938. | ||
| Application 12/010938 is a division of application No. 11/882275, filed on Jul. 31, 2007, granted, now 7,349,088. | ||
| Application 11/882275 is a continuation of application No. 10/969860, filed on Oct. 22, 2004, granted, now 7,327,455. | ||
| Claims priority of application No. P2003-362134 (JP), filed on Oct. 22, 2003. | ||
| Prior Publication US 2008/0137083 A1, Jun. 12, 2008 | ||
| Int. Cl. G01N 21/55 (2006.01) | ||
| U.S. Cl. 356—445 [356/364] | 4 Claims |
| 1. A process monitoring system comprising:
a process chamber configured to hold an object to be processed;
an illumination source configured to emit a light to the object;
a monitor window provided on the process chamber to propagate the light, the monitor window having a plurality of nozzle holes,
the diameter of the nozzle holes being smaller than a beam diameter of the light in the monitor window; and
a monitoring information processor configured to detect the light reflected from the object.
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