| US 7,595,559 B2 | ||
| Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip | ||
| Seung Duk Baek, Gyeonggi-do (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., (Korea, Republic of) | ||
| Filed on Jan. 26, 2006, as Appl. No. 11/339,973. | ||
| Prior Publication US 2006/0118972 A1, Jun. 08, 2006 | ||
| Int. Cl. H01L 23/535 (2006.01) | ||
| U.S. Cl. 257—777 [257/288; 257/E23.079; 257/774] | 9 Claims |
| 1. An integrated circuit chip, comprising:
a semiconductor substrate;
a first integrated circuit device extending adjacent a first side of said semiconductor substrate and having a first plurality
of chip pads thereon;
a second integrated circuit device extending adjacent a second side of said semiconductor substrate and having a second plurality
of chip pads thereon;
first and second pluralities of via holes extending through a portion of said semiconductor substrate located between the
first and second integrated circuit devices;
a first plurality of rerouting conductors extending from corresponding ones of the first plurality of chip pads to corresponding
ones of the first plurality of via holes; and
a second plurality of rerouting conductors extending from corresponding ones of the second plurality of chip pads to corresponding
ones of the second plurality of via holes;
wherein the integrated circuit chip is configured so that all electrical connections to said first and second integrated circuit
devices are provided through the first and second pluralities of via holes; and
wherein all of the first and second pluralities of via holes are provided between the first and second integrated circuit
devices.
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