| US 7,595,551 B2 | ||
| Semiconductor package for a large die | ||
| Kambhampati Ramakrishna, Chandler, Ariz. (US) | ||
| Assigned to ST Assembly Test Services Ltd., Singapore (Singapore) | ||
| Filed on Jun. 28, 2005, as Appl. No. 11/169,850. | ||
| Application 11/169850 is a division of application No. 10/606429, filed on Jun. 25, 2003, granted, now 6,927,479. | ||
| Prior Publication US 2005/0236702 A1, Oct. 27, 2005 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—686 [257/777; 257/666; 257/E25.006; 257/E25.013] | 10 Claims |
| 1. A semiconductor package for a large die comprising:
a die pad;
a plurality of bonding fingers having contact pads;
a spacer attached by a first adhesive to the die pad;
the large die extending over the contact pads and the spacer, the large die attached by a second adhesive to the spacer and
supported only by the first adhesive, the second adhesive, and the spacer on the die pad;
bonding wires bonded between the large die and the plurality of bonding fingers, the bonding wires having portions parallel
to a side of the large die; and
an encapsulant to encapsulate the die pad, the plurality of bonding fingers, the spacer, the large die, and the bonding wires.
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