| US 7,595,550 B2 | ||
| Flex-based circuit module | ||
| James W. Cady, Austin, Tex. (US); James Wilder, Austin, Tex. (US); David L. Roper, Austin, Tex. (US); and James Douglas Wehrly, Jr., Austin, Tex. (US) | ||
| Assigned to Entorian Technologies, LP, Austin, Tex. (US) | ||
| Filed on Jul. 01, 2005, as Appl. No. 11/173,445. | ||
| Application 11/173445 is a continuation of application No. 10/814532, filed on Mar. 31, 2004, granted, now 6,956,284. | ||
| Application 10/814532 is a continuation in part of application No. PCT/US03/29000, filed on Sep. 15, 2003. | ||
| Application PCT/US03/29000 is a continuation in part of application No. 10/453398, filed on Jun. 03, 2003, granted, now 6,914,324. | ||
| Application 10/453398 is a continuation in part of application No. 10/005581, filed on Oct. 26, 2001, granted, now 6,576,992. | ||
| Prior Publication US 2005/0263872 A1, Dec. 01, 2005 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—685 [257/693; 257/694; 257/723; 257/E25.006; 257/E25.018; 257/E25.027; 257/E23.085] | 4 Claims |
| 1. A circuit module comprising:
a flex circuit populated with CSPs and which flex circuit exhibits plural connective contacts, and including first and second
conductive layers; and
an axial form about which the flex circuit is disposed to present the plural connective contacts for connection to an application
environment;
wherein CSP contacts contact a first surface of the first conductive layer and application environment contacts contact a
second surface of the first conductive layer.
|