| US 7,595,548 B2 | ||
| Physical quantity sensor and manufacturing method therefor | ||
| Kenichi Shirasaka, Hamamatsu (Japan); and Hiroshi Saitoh, Iwata (Japan) | ||
| Assigned to Yamaha Corporation, Shizuoka-Ken (Japan) | ||
| Filed on Oct. 06, 2005, as Appl. No. 11/244,194. | ||
| Claims priority of application No. P2004-296371 (JP), filed on Oct. 08, 2004; application No. P2005-045299 (JP), filed on Feb. 22, 2005; application No. 2005-089629 (JP), filed on Mar. 25, 2005; and application No. 2005-094388 (JP), filed on Mar. 29, 2005. | ||
| Prior Publication US 2006/0087006 A1, Apr. 27, 2006 | ||
| Int. Cl. H01L 23/495 (2006.01) | ||
| U.S. Cl. 257—676 [257/666; 257/692; 257/E23.43] | 1 Claim |
| 1. A physical quantity sensor comprising:
an exterior mold package that is molded using a resin, wherein side surfaces of the exterior mold package are each inclined
inwardly in a thickness direction by an angle, which ranges from 0° to 5°;
a pair of physical quantity sensor chips incorporated into the exterior mold package, the pair of physical quantity sensor
chips being inclined with respect to a bottom of the exterior mold package, wherein the side surfaces of the exterior mold
package are formed in proximity to outer ends of the physical quantity sensor chips, and the side surface of the exterior
mold package and the pair of physical quantity sensor chips are each arranged opposite to each other; and
a plurality of leads electrically connected to the physical quantity sensor chips in such a way that the leads partially overlap
with the physical quantity sensor chips in the thickness direction, wherein the plurality of leads each has an inclination
portion, which is inclined with respect to the bottom of the exterior mold package and on which the physical quantity sensor
chips are arranged.
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