| US 7,595,131 B2 | ||
| Connection between a conductive substrate and a laminate | ||
| David Albert James, Mount Waverley (Australia); Richard Michael Stephens, Lower Plenty (Australia); and Alina Kay Sloan, Port Melbourne (Australia) | ||
| Assigned to Cap-XX Limited, Dee Why, NSW (Australia) | ||
| Appl. No. 10/433,860 PCT Filed Dec. 10, 2001, PCT No. PCT/AU01/01590 § 371(c)(1), (2), (4) Date Nov. 12, 2003, PCT Pub. No. WO02/47099, PCT Pub. Date Jun. 13, 2002. |
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| Claims priority of application No. PR1994 (AU), filed on Dec. 09, 2000. | ||
| Prior Publication US 2004/0076877 A1, Apr. 22, 2004 | ||
| Int. Cl. H01M 2/30 (2006.01) | ||
| U.S. Cl. 429—181 [429/170; 429/162] | 20 Claims |
| 1. A connection assembly including:
a conductive substrate;
a laminate having:
a polymer layer that is secured to the substrate, the polymer layer having adhesive properties;
a conductive layer disposed adjacent to the polymer layer and being spaced apart from the substrate wherein the polymer layer
and the conductive layer both terminate at a common edge that overlies the substrate; and
an inner plastics layer intermediate to the conductive layer and the polymer layer, wherein the inner plastics layer has a
high melting point relative to the polymer layer for reducing the risk of the conductive layer being shorted to the substrate;
and
an insulator in the form of a grommet that is integrally formed from the polymer layer and which extends over the common edge
for electrically insulating the conductive layer from the substrate.
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