| US 7,593,872 B2 | ||
| Method and system for designing a probe card | ||
| Benjamin N. Eldridge, Danville, Calif. (US); Mark W. Brandemuehl, Mountain View, Calif. (US); Stefan Graef, Milpitas, Calif. (US); and Yves Parent, San Francisco, Calif. (US) | ||
| Assigned to FormFactor, Inc., Livermore, Calif. (US) | ||
| Filed on Aug. 15, 2006, as Appl. No. 11/464,760. | ||
| Application 11/464760 is a division of application No. 10/810758, filed on Mar. 26, 2004, granted, now 7,092,902. | ||
| Application 10/810758 is a continuation of application No. 09/954617, filed on Sep. 17, 2001, granted, now 6,714,828. | ||
| Prior Publication US 2006/0294008 A1, Dec. 28, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G06Q 30/00 (2006.01) | ||
| U.S. Cl. 705—26 [700/96; 700/97; 700/117; 700/180; 324/761; 709/203] | 16 Claims |

| 1. A method performed at a probe card manufacturer server computer of designing a probe card, wherein said probe card provides
an interface for test signals between a tester and a semiconductor device to be tested and said probe card comprises tester
contacts for making electrical connections with said tester, probes for making electrical connections with terminals of said
semiconductor device, and electrical paths connecting ones of said tester contacts with ones of said probes, said method comprising:
receiving at said probe card manufacturer server computer from a remotely located customer computer device information describing
said semiconductor device;
receiving at said probe card manufacturer server computer from said remotely located customer computer probe card information
describing said probe card;
generating at said probe card manufacturer server computer from said device information and said probe card information a
verification package that includes a proposed design of said probe card for testing said semiconductor device;
electronically determining at said probe card manufacturer server computer an acceptability of said proposed design of said
probe card; and
communicating from said probe card manufacturer server computer to said customer computer said verification package and said
electrically generated acceptability of said proposed design.
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