| US 7,592,699 B2 | ||
| Hidden plating traces | ||
| Hem Takiar, Fremont, Calif. (US); Cheemen Yu, Madison, Wis. (US); Ken Jian Ming Wang, San Francisco, Calif. (US); Chin-Tien Chiu, Taichung (Taiwan); Han-Shiao Chen, Da-an Township, Taichung County (Taiwan); and Chih-Chin Liao, Changhua (Taiwan) | ||
| Assigned to SanDisk Corporation, Milpitas, Calif. (US) | ||
| Filed on Dec. 29, 2005, as Appl. No. 11/321,929. | ||
| Prior Publication US 2007/0152319 A1, Jul. 05, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 23/04 (2006.01) | ||
| U.S. Cl. 257—730 [257/670; 257/673; 257/690; 257/E23.031] | 18 Claims |
| 1. A substrate for a semiconductor package capable of being encased within a lid, the substrate comprising:
a contact finger capable of mating with an electrical pad on a host device; and
a plating trace for allowing the contact finger to be plated, the plating trace having a first end extending from the contact
finger and a second end opposite the first end terminating adjacent an edge of the substrate, the second end being positioned
on the substrate at a position that is beneath the lid when the semiconductor package is encased within the lid.
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