US 7,592,665 B2
Non-volatile memory devices having floating gates
Joon-Hee Lee, Seongnam-si (Korea, Republic of); Jong-Ho Park, Seoul (Korea, Republic of); Jin-Hyun Shin, Suwon-si (Korea, Republic of); Sung-Hoi Hur, Seoul (Korea, Republic of); Yong-Seok Kim, Seoul (Korea, Republic of); and Jong-Won Kim, Hwaseong-si (Korea, Republic of)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (Korea, Republic of)
Filed on Nov. 08, 2006, as Appl. No. 11/594,327.
Claims priority of application No. 10-2005-0107907 (KR), filed on Nov. 11, 2005.
Prior Publication US 2007/0108498 A1, May 17, 2007
Int. Cl. H01L 29/788 (2006.01)
U.S. Cl. 257—316  [257/321] 9 Claims
OG exemplary drawing
 
1. A nonvolatile memory device comprising:
a substrate including a cell region and a peripheral circuit region;
a cell device isolation layer disposed on the cell region of the substrate to define a cell active region;
a floating gate including a lower floating gate and an upper floating gate sequentially stacked on the cell active region wherein the upper floating gate includes a flat portion disposed on the lower floating gate and a pair of wall portions extending upward from both edges of the flat portion adjacent to the cell device isolation layer, and a width of an upper portion of a space surrounded by the flat portion and the pair of wall portions is larger than a width of a lower portion of the space;
a tunnel insulation pattern interposed between the floating gate and the cell active region;
a control gate electrode disposed on the floating gate; and
a blocking insulation pattern interposed between the control gate electrode and the floating gate;
a peripheral device isolation layer formed on the peripheral region to define a peripheral active region;
a peripheral gate electrode including a lower gate electrode and an upper gate electrode sequentially stacked on the peripheral active region, the upper gate electrode being connected with the lower gate electrode; and
a peripheral gate insulation pattern interposed between the peripheral gate electrode and the peripheral active region,
wherein the lower gate electrode comprises,
a first lower gate disposed on the peripheral gate insulation pattern,
a second lower gate including a peripheral flat portion disposed on the first lower gate and a pair of peripheral wall portions extending upward from both edges of the peripheral flat portion adjacent to the peripheral device isolation layer, and
a third lower gate filling a hollow region surrounded by the peripheral flat portion and the pair of peripheral wall portions.