| US 7,592,631 B2 | ||
| LED package frame and LED package having the same | ||
| Young Sam Park, Seoul (Korea, Republic of); Seung Ick Lee, Kyungki-do (Korea, Republic of); Hun Joo Hahm, Kyungki-do (Korea, Republic of); Hyung Suk Kim, Kyungki-do (Korea, Republic of); Bum Jin Kim, Kyungki-do (Korea, Republic of); Young June Jeong, Kyungki-do (Korea, Republic of); Ho Sik Ahn, Kyungki-do (Korea, Republic of); and Jung Kyu Park, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon, Kyungki-Do (Korea, Republic of) | ||
| Filed on Dec. 28, 2005, as Appl. No. 11/319,101. | ||
| Claims priority of application No. 10-2005-0008773 (KR), filed on Jan. 31, 2005. | ||
| Prior Publication US 2006/0169999 A1, Aug. 03, 2006 | ||
| Int. Cl. H01L 27/15 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2006.01) | ||
| U.S. Cl. 257—81 [257/E33.066; 257/79; 257/82; 257/99; 257/433; 438/26; 313/512] | 3 Claims |
| 1. An Light Emitting Diode (LED) package frame, comprising:
an LED chip;
a heat conductive member made of high heat conductivity material, wherein the heat conductive member comprising:
a central column;
a plate member extending around the central column and integral with the central column;
a circumference of the plate has a cutout to define a receiving part;
an upper flat surface of the plate member has an opening that opens downwardly into the receiving part;
a lead extending through the receiving part and exposed in the opening;
an insulating layer placed in contact between the lead and the head conductive member; and
a wire extending through the opening to connect the LED chip and the exposed lead.
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