| US 7,592,237 B2 | ||
| Laser processing method and object to be processed | ||
| Takeshi Sakamoto, Hamamatsu (Japan); and Kenichi Muramatsu, Hamamatsu (Japan) | ||
| Assigned to Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka (Japan) | ||
| Appl. No. 10/594,892 PCT Filed Mar. 02, 2005, PCT No. PCT/JP2005/003515 § 371(c)(1), (2), (4) Date Jun. 19, 2007, PCT Pub. No. WO2005/098914, PCT Pub. Date Oct. 20, 2005. |
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| Claims priority of application No. 2004-100516 (JP), filed on Mar. 30, 2004. | ||
| Prior Publication US 2007/0287267 A1, Dec. 13, 2007 | ||
| Int. Cl. H01L 21/301 (2006.01); H01L 21/46 (2006.01); H01L 21/78 (2006.01) | ||
| U.S. Cl. 438—462 [438/114; 438/460; 438/113; 438/463] | 10 Claims |
| 1. A laser processing method for irradiating a substrate having a front face formed with a laminate part including a plurality
of functional devices with laser light while locating a light-converging point within the substrate, so as to form a modified
region to become a start point for cutting within the substrate along a line to cut the substrate;
the method comprising the steps of:
forming a first modified region along a first line to cut for cutting the substrate and laminate part into a plurality of
blocks; and
forming a second modified region along a second line to cut for cutting the blocks into a plurality of chips, each chip including
at least one of the functional devices;
wherein the first modified region is more likely to cause the substrate to fracture than is the second modified region.
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