| US 7,592,035 B2 | ||
| Method of coating microelectronic substrates | ||
| James P. DeYoung, Durham, N.C. (US); James B. McClain, Raleigh, N.C. (US); Stephen M. Gross, Chapel Hill, N.C. (US); Doug Taylor, Franklinton, N.C. (US); Mark I. Wagner, Raleigh, N.C. (US); and David Brainard, Wake Forest, N.C. (US) | ||
| Assigned to Micell Technologies, Inc., Raleigh, N.C. (US) | ||
| Filed on Oct. 28, 2005, as Appl. No. 11/261,299. | ||
| Application 11/261299 is a division of application No. 10/681515, filed on Oct. 08, 2003, granted, now 6,989,172. | ||
| Claims priority of provisional application 60/442867, filed on Jan. 27, 2003. | ||
| Prior Publication US 2006/0035014 A1, Feb. 16, 2006 | ||
| Int. Cl. B05D 5/12 (2006.01) | ||
| U.S. Cl. 427—58 | 17 Claims |
| 1. A method for depositing a film of a material onto a surface of a substrate, said method comprising:
(a) dissolving a precursor of the material into a solvent to form a supercritical or near-supercritical solution;
(b) forming a thin film of said solution on said substrate under conditions in which said precursor is stable in said solution;
and then
(c) contacting a conversion reagent to said thin film under conditions that initiate a chemical reaction involving said precursor
and form a film of a chemically converted material on the surface of said substrate,
wherein forming the thin film in step (b) is carried out by displacing said supercritical or near-supercritical solution with
a separate compressed gas atmosphere that forms a boundary therebetween and said thin film is deposited from said boundary.
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