	US 7,591,973 B2
	Method for producing a fiber-reinforced composite material plate
Tsuneo Takano, Aichi-ken (Japan); Akitada Yanase, Aichi-ken (Japan); Tadashi Sakai, Tokyo (Japan); Kiharu Numata, Aichi-ken (Japan); Akihiro Ito, Aichi-ken (Japan); Masato Taguchi, Tokyo (Japan); Junichi Muramatsu, Aichi-ken (Japan); Kazuya Goto, Irvine, Calif. (US); and Kazuki Koga, Aichi-ken (Japan)
Assigned to Mitsubishi Rayon Co., Ltd., Tokyo (Japan)
Appl. No. 10/536,275 PCT Filed Nov. 28, 2003, PCT No. PCT/JP03/15276 § 371(c)(1), (2), (4) Date May 25, 2005, PCT Pub. No. WO2004/048435, PCT Pub. Date Jun. 10, 2004.
Claims priority of application No. 2002-346198 (JP), filed on Nov. 28, 2002; application No. 2002-347650 (JP), filed on Nov. 29, 2002; application No. 2002-353760 (JP), filed on Dec. 05, 2002; and application No. 2002-362519 (JP), filed on Dec. 13, 2002.
Prior Publication US 2006/0035088 A1, Feb. 16, 2006
Int. Cl. B29C 43/00 (2006.01); B32B 27/04 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01)

U.S. Cl. 264—320 [264/241; 264/299; 264/319; 428/297.4; 428/298.1; 428/299.1; 525/523]

10 Claims

1. A method for producing a fiber-reinforced composite material plate, comprising:

preparing a prepreg comprising a reinforced fiber and an epoxy resin composition; and

heating and pressurizing the prepreg for a molding time of 15 minutes or less, at a molding temperature of at least 120° C. and a molding pressure of at least 10 kg/cm², to mold the prepreg into the fiber-reinforced composite material plate;

wherein the epoxy resin composition, comprises:

a component A;

a component B;

a component C; and

a component D;

wherein:

a content of a sulfur atom in the composition is from 0.2 to 7% by mass;

a content of component C in the composition is from 1 to 15% by mass;

the component A comprises an epoxy resin;

the component B comprises an amine compound having at least one sulfur atom in a molecule thereof (component B-1) and/or a reaction product of the epoxy resin and the amine compound having at least one sulfur atom in the molecule thereof (component B-2);

the component C comprises a urea compound; and

the component D comprises a dicyandiamide.