| US 7,591,920 B1 | ||
| Techniques for bonding substrates using dynamic alternating electric field | ||
| Kal Leung Fan, Hong Kong (China); and Ming Sang Yeung, Hong Kong (China) | ||
| Assigned to Dongguan Anwell Digital Machinery Co., Ltd., (China) | ||
| Filed on Dec. 02, 2005, as Appl. No. 11/292,918. | ||
| Application 11/292918 is a continuation in part of application No. 11/170022, filed on Jun. 28, 2005, abandoned. | ||
| Int. Cl. B32B 37/00 (2006.01) | ||
| U.S. Cl. 156—272.2 [156/274.4; 156/275.5] | 23 Claims |
| 1. A method for bonding substrates to form an optical disc, the method comprising:
dispensing a certain amount of glue on a first substrate;
moving the first substrate and a second substrate relatively towards each other;
applying a random signal from a power source across the first and second substrates to create an electric field with random
frequency and/or magnitude to eliminate possible bubbles in the glue for a predefined time, before the first substrate and
the second substrate are pushed towards each other for bonding; and
rotating the first and second substrates together at a substantially high speed to spread evenly the glue therebetween by
a centrifugal force while compressing the first and second substrates for bonding.
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