| US 7,591,872 B1 | ||
| Method for producing silver nanoparticles and conductive ink | ||
| Byung-Ho Jun, Seoul (Korea, Republic of); Kwi-Jong Lee, Seoul (Korea, Republic of); Hye-Jin Cho, Suwon-si (Korea, Republic of); and Jae-Woo Joung, Suwon-si (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon (Korea, Republic of) | ||
| Filed on Aug. 04, 2006, as Appl. No. 11/498,837. | ||
| Claims priority of application No. 10-2005-0072478 (KR), filed on Aug. 08, 2005. | ||
| Int. Cl. B22F 9/24 (2006.01) | ||
| U.S. Cl. 75—371 [977/896] | 11 Claims |
| 1. A method of producing metal nanoparticles, said method comprising:
mixing a metal precursor with a copper compound as a reducing agent to a hydrocarbon-based solvent, said metal precursor containing
a metal having a higher standard oxidation/reduction potential than that of copper;
mixing an amine-based compound to the mixed solution of the metal precursor with a copper compound and hydrocarbon-based solvent;
and
mixing a compound including one or more atoms having at least one lone pair, selected from a group consisting of nitrogen,
oxygen, sulfur and phosphorous, to the mixed solution of the amine-based compound, metal precursor with copper compound and
hydrocarbon-based solvent.
|