| US 7,591,406 B2 | ||
| Soldering method, soldering device, bonding method, bonding device, and nozzle unit | ||
| Tatsuya Wagoh, Tokyo (Japan); Toru Mizuno, Tokyo (Japan); and Osamu Shindo, Tokyo (Japan) | ||
| Assigned to TDK Corporation, Tokyo (Japan) | ||
| Filed on Mar. 29, 2006, as Appl. No. 11/277,867. | ||
| Claims priority of application No. 2005-097614 (JP), filed on Mar. 30, 2005; and application No. 2005-320252 (JP), filed on Nov. 04, 2005. | ||
| Prior Publication US 2006/0219760 A1, Oct. 05, 2006 | ||
| Int. Cl. B23K 26/00 (2006.01) | ||
| U.S. Cl. 228—11 [228/14; 239/96; 222/601; 222/188; 222/590; 222/602; 134/24] | 1 Claim |
| 1. A bonding device for bonding an electronic component to a substrate, comprising:
holding/releasing means for releasably holding a solid bonding member at a position spaced apart by a predetermined distance
from a bonding position on the substrate to which the electronic component is bonded;
ejecting means for ejecting the bonding member onto the bonding position;
heating means for heating the bonding member by applying heat radiation to impart heat to the bonding member; and
control means for synchronizing releasing of the holding by the holding/releasing means and the heating by the heating means,
wherein, after releasing the holding of the bonding member by the control means, the bonding member is heated to thereby bond
the electronic component to the bonding position on the substrate,
wherein the holding/releasing means effects the holding or the releasing of the bonding member by a direct-acting system,
a pivoting system, or a swiveling system, and
wherein the holding/releasing means has a nozzle assembly with an opening and an opening/closing member for opening and closing
the opening, and wherein the opening/closing member is driven by a piezoelectric actuator.
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