| US 7,591,069 B2 | ||
| Methods of bonding solder balls to bond pads on a substrate, and bonding frames | ||
| Warren M. Farnworth, Nampa, Id. (US); and Alan G. Wood, Boise, Id. (US) | ||
| Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
| Filed on Aug. 30, 2004, as Appl. No. 10/930,236. | ||
| Application 10/930236 is a division of application No. 10/303141, filed on Nov. 23, 2002, granted, now 6,857,183, filed on Feb. 22, 2005. | ||
| Application 10/303141 is a division of application No. 09/148723, filed on Sep. 03, 1998, granted, now 7,003,874, filed on Feb. 28, 2006. | ||
| Prior Publication US 2005/0023259 A1, Feb. 03, 2005 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H05K 3/34 (2006.01); B23K 26/08 (2006.01) | ||
| U.S. Cl. 29—840 [29/843; 29/860; 219/121.78; 219/121.8] | 14 Claims |
| 1. A fluxless solder ball bonding method, comprising:
providing a frame;
providing a substrate comprising a plurality of individual bond pads;
placing at least portions of respective ones of a plurality of balls of solder within the frame and in registered alignment
with respective ones of the individual bond pads;
while the ball portions are within the frame, moving a beam of directional bonding energy relative to the frame, and bonding
respective ones of the plurality of balls of solder to the respective ones of the individual bond pads using the beam of directional
bonding energy; and
wherein the step of placing further comprises immersing the frame into a volume of the plurality of balls of solder.
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