US 11,758,705 B2
Electromagnetic wave shielding film
Takahiko Katsuki, Kizugawa (JP); Hiroshi Tajima, Kizugawa (JP); and Yuusuke Haruna, Kizugawa (JP)
Assigned to TATSUTA ELECTRIC WIRE & CABLE CO., LTD, Osaka (JP)
Appl. No. 17/801,054
Filed by TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Higashiosaka (JP)
PCT Filed Feb. 25, 2021, PCT No. PCT/JP2021/006983
§ 371(c)(1), (2) Date Aug. 19, 2022,
PCT Pub. No. WO2021/172396, PCT Pub. Date Sep. 2, 2021.
Claims priority of application No. 2020-029765 (JP), filed on Feb. 25, 2020.
Prior Publication US 2023/0086849 A1, Mar. 23, 2023
Int. Cl. H05K 9/00 (2006.01)
CPC H05K 9/0084 (2013.01) 3 Claims
OG exemplary drawing
 
1. An electromagnetic wave shielding film, comprising:
a conductive adhesive layer, a shielding layer, and an insulating layer laminated in this order,
wherein a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer in accordance with ISO14577-1 to Martens hardness of the insulating layer in accordance with ISO14577-1 is 0.3 or more.