US 11,758,685 B2
Thermal module with a hyperbaric fan system for cooling multiple fin stacks and components in a sealed chassis
Travis C. North, Cedar Park, TX (US); and Qinghong He, Austin, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on May 24, 2021, as Appl. No. 17/328,526.
Prior Publication US 2022/0377933 A1, Nov. 24, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20145 (2013.01) [H05K 7/20209 (2013.01); H05K 7/20554 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A thermal module for cooling a sealed chassis for an information handling system, the thermal module comprising:
at least one fan comprising:
a fan housing for a fan motor and a plurality of fan blades, the fan housing having an intake for drawing airflow into the fan and a plurality of fan outlets for directing the airflow out of the fan housing, wherein:
a fan-body ratio defined as a ratio of a first dimension comprising a diameter of the plurality of fan blades relative to a second dimension comprising one of a width of the fan housing or a length of the fan housing is at least 80%;
a first fan outlet is configured to direct a first portion of the airflow to a first fin stack with a first impedance toward a rear cover vent on the chassis to an ambient environment;
a second fan outlet is configured to direct a second portion of the airflow to a second fin stack with a second impedance toward a side cover vent on the chassis to the ambient environment; and
a third fan outlet is configured to direct a third portion of the airflow toward a plurality of components inside the chassis, wherein the first fan outlet, the first fin stack, the second fan outlet, the second fin stack and the third fan outlet are configured to distribute the first portion of the airflow, the second portion of the airflow and the third portion of the airflow according to a ratio, wherein the second portion of the airflow is less than the first portion of the airflow and the third portion of the airflow.