US 11,758,643 B2
Printed circuit board and printing apparatus
Yo Kobayashi, Nagareyama (JP); and Koji Hirai, Yokohama (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 26, 2022, as Appl. No. 17/729,933.
Application 17/729,933 is a continuation of application No. 16/983,804, filed on Aug. 3, 2020, granted, now 11,343,903.
Claims priority of application No. 2019-147445 (JP), filed on Aug. 9, 2019.
Prior Publication US 2022/0256689 A1, Aug. 11, 2022
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0219 (2013.01) [H05K 1/0215 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/10409 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A printed circuit board comprising a conductor layer designed on one side of one substrate layer including:
a first ground region on which a connector to be connected with an external apparatus or communication cable is mounted and which is connected with a ground; and
a second ground region separated from the first ground region at the conductor layer, the second ground region being at a position that is outside the first ground region at least in a region corresponding to an opening of the connector on the conductor layer, and connected with a ground,
wherein the opening is an insertion opening of the connector into which the external apparatus or the communication cable are to be inserted.