CPC H03H 9/1092 (2013.01) [H01L 23/31 (2013.01); H01L 23/488 (2013.01); H03H 9/02992 (2013.01); H03H 9/059 (2013.01); H03H 9/14541 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01)] | 5 Claims |
1. A manufacturing method for surface acoustic wave filter package structure, comprising:
forming a dielectric substrate with a first side and a second side on a carrier board, wherein the dielectric substrate has a first patterned conductive layer, a dielectric layer, a conductive connection layer, and a second patterned conductive layer;
forming a plurality of polymer sealing frames on the second side of the dielectric substrate, wherein each of the polymer sealing frames has an opening to partially expose out of the dielectric substrate;
arranging a plurality of the chips onto corresponding polymer sealing frames, wherein, an active surface of each of the plurality of the chips faces toward the second side of the dielectric substrate, and corresponds to the respective opening of the polymer sealing frame to form a closed cavity by the corresponding polymer sealing frame, the chip and the dielectric substrate;
forming a mold sealing layer to cover the plurality of chips and the plurality of polymer sealing frames, and a side of the plurality of polymer sealing frames is exposed out of the mold sealing layer; and
removing the carrier board.
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