US 11,757,378 B1
Micromechanical arm array in micro-electromechanical system (MEMS) actuators
Shih-Yu Liao, Hsinchu (TW); and Tsai-Hao Hung, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 6, 2022, as Appl. No. 17/833,827.
Int. Cl. H02N 1/00 (2006.01); B81B 7/00 (2006.01); B81B 5/00 (2006.01); H04N 23/68 (2023.01)
CPC H02N 1/006 (2013.01) [B81B 7/0016 (2013.01); B81B 2203/0136 (2013.01); H04N 23/687 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A micromechanical arm array comprising:
a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction;
a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and
a metal connection structure extending in the first horizontal direction and comprising:
a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and
a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.