CPC H01L 25/0652 (2013.01) [H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/5383 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01)] | 20 Claims |
1. A multi-chip package, comprising:
an interposer disposed over a first side of a first redistribution layer structure and comprising, from bottom to top, an interposer substrate, interposer redistribution layers and interposer connectors;
a first encapsulation layer laterally encapsulating the interposer and in physical contact with the interposer connectors of the interposer;
a second redistribution layer structure disposed over and electrically connected to the interposer connectors of the interposer; and
semiconductor chips disposed over and electrically connected to the second redistribution layer structure.
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