CPC H01L 24/29 (2013.01) [H01L 23/3675 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/29018 (2013.01)] | 6 Claims |
1. A power module including:
a spacer;
a first substrate having a first metal layer including an upper surface having a bonding region in which the spacer is bonded by a first solder; and
at least one wire located in the first solder within the bonding region;
a power semiconductor chip having a first surface which is bonded to the spacer in an opposite direction of the first substrate;
a second substrate having a second metal layer bonded to a second surface of the power semiconductor chip; and
a metal ball disposed in a second solder between a third metal layer included in the second substrate and the power semiconductor chip to secure a minimum height of the second solder by a height of the metal ball.
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