US 11,756,915 B2
Method and structure to control the solder thickness for double sided cooling power module
Tae Hwa Kim, Hwaseong-Si (KR); and Myung Ill You, Gwangju (KR)
Assigned to Huyndai Motor Company, Seoul (KR); and Kia Motors Corporation, Seoul (KR)
Filed by Hyundai Motor Company, Seoul (KR); and Kia Motors Corporation, Seoul (KR)
Filed on Sep. 28, 2020, as Appl. No. 17/35,430.
Claims priority of application No. 10-2020-0047552 (KR), filed on Apr. 20, 2020.
Prior Publication US 2021/0327842 A1, Oct. 21, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/367 (2006.01)
CPC H01L 24/29 (2013.01) [H01L 23/3675 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/29018 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A power module including:
a spacer;
a first substrate having a first metal layer including an upper surface having a bonding region in which the spacer is bonded by a first solder; and
at least one wire located in the first solder within the bonding region;
a power semiconductor chip having a first surface which is bonded to the spacer in an opposite direction of the first substrate;
a second substrate having a second metal layer bonded to a second surface of the power semiconductor chip; and
a metal ball disposed in a second solder between a third metal layer included in the second substrate and the power semiconductor chip to secure a minimum height of the second solder by a height of the metal ball.