CPC H01L 23/585 (2013.01) [H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/33 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 29/0649 (2013.01); H01L 23/562 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06593 (2013.01)] | 20 Claims |
1. A structure comprising:
a base die, the base die comprising:
a first plurality of bond pads disposed at an upper surface of the base die at a die attach area,
a second plurality of bond pads disposed at the upper surface of the base die outside the die attach area, and
a keep out area interposed between the first plurality of bond pads and the second plurality of bond pads, the keep out area free of bond pads; and
an upper die bonded to the base die, the upper die comprising:
a third plurality of bond pads disposed at a lower surface of the upper die, the third plurality of bond pads bonded to the first plurality of bond pads, and
a second seal ring embedded in the upper die, the second seal ring aligned to the keep out area of the base die.
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