US 11,756,901 B2
Seal ring for hybrid-bond
Chih-Chia Hu, Taipei (TW); Chun-Chiang Kuo, Kaohsiung (TW); Sen-Bor Jan, Tainan (TW); Ming-Fa Chen, Taichung (TW); and Hsien-Wei Chen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 5, 2022, as Appl. No. 17/881,739.
Application 17/881,739 is a continuation of application No. 16/989,492, filed on Aug. 10, 2020, granted, now 11,482,499.
Application 16/989,492 is a continuation of application No. 16/429,735, filed on Jun. 3, 2019, granted, now 10,741,506, issued on Aug. 11, 2020.
Application 16/429,735 is a continuation of application No. 16/003,654, filed on Jun. 8, 2018, granted, now 10,312,201, issued on Jun. 4, 2019.
Claims priority of provisional application 62/592,856, filed on Nov. 30, 2017.
Prior Publication US 2022/0375878 A1, Nov. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/58 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/585 (2013.01) [H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/33 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 29/0649 (2013.01); H01L 23/562 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06593 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure comprising:
a base die, the base die comprising:
a first plurality of bond pads disposed at an upper surface of the base die at a die attach area,
a second plurality of bond pads disposed at the upper surface of the base die outside the die attach area, and
a keep out area interposed between the first plurality of bond pads and the second plurality of bond pads, the keep out area free of bond pads; and
an upper die bonded to the base die, the upper die comprising:
a third plurality of bond pads disposed at a lower surface of the upper die, the third plurality of bond pads bonded to the first plurality of bond pads, and
a second seal ring embedded in the upper die, the second seal ring aligned to the keep out area of the base die.