US 11,756,894 B2
Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods
Jeahyeong Han, San Diego, CA (US); Rajneesh Kumar, San Diego, CA (US); Jeongil Jay Kim, San Diego, CA (US); and Chin-Kwan Kim, San Diego, CA (US)
Assigned to QUALCOMM INCORPORATED, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on May 20, 2020, as Appl. No. 16/879,517.
Prior Publication US 2021/0366838 A1, Nov. 25, 2021
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, comprising:
a first layer comprising an IC die, the first layer comprising a first layer sidewall;
a substrate antenna layer comprising an antenna layer sidewall that extends a first distance in a horizontal direction;
a substrate disposed between the substrate antenna layer and the first layer, the substrate comprising a substrate sidewall that at least partially extends a second distance less than the first distance in the horizontal direction towards the antenna layer sidewall to create a shoulder area; and
an electro-magnetic interference (EMI) shield disposed on the first layer and adjacent to the first layer sidewall and the substrate sidewall,
a bottom surface of the EMI shield disposed on the shoulder area.