CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01)] | 19 Claims |
1. An integrated circuit (IC) package, comprising:
a first layer comprising an IC die, the first layer comprising a first layer sidewall;
a substrate antenna layer comprising an antenna layer sidewall that extends a first distance in a horizontal direction;
a substrate disposed between the substrate antenna layer and the first layer, the substrate comprising a substrate sidewall that at least partially extends a second distance less than the first distance in the horizontal direction towards the antenna layer sidewall to create a shoulder area; and
an electro-magnetic interference (EMI) shield disposed on the first layer and adjacent to the first layer sidewall and the substrate sidewall,
a bottom surface of the EMI shield disposed on the shoulder area.
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