US 11,756,893 B2
Semiconductor device with alignment marks and method for fabricating the same
Tse-Yao Huang, Taipei (TW)
Assigned to NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed by NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed on Dec. 3, 2021, as Appl. No. 17/541,754.
Prior Publication US 2023/0178493 A1, Jun. 8, 2023
Int. Cl. H01L 23/544 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/544 (2013.01) [H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first wafer comprising:
a first substrate; and
a plurality of first alignment marks positioned on the first substrate and parallel to each other; and
a second wafer positioned on the first wafer and comprising:
a plurality of second alignment marks positioned above the plurality of first alignment marks;
wherein the plurality of second alignment marks are arranged parallel to the plurality of first alignment marks and adjacent to the plurality of first alignment marks in a top-view perspective;
wherein the plurality of first alignment marks and the plurality of second alignment marks comprise a fluorescence material;
wherein the plurality of first alignment marks and the plurality of second alignment marks together configure a first set of alignment marks.