CPC H01L 23/544 (2013.01) [H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01)] | 17 Claims |
1. A semiconductor device, comprising:
a first wafer comprising:
a first substrate; and
a plurality of first alignment marks positioned on the first substrate and parallel to each other; and
a second wafer positioned on the first wafer and comprising:
a plurality of second alignment marks positioned above the plurality of first alignment marks;
wherein the plurality of second alignment marks are arranged parallel to the plurality of first alignment marks and adjacent to the plurality of first alignment marks in a top-view perspective;
wherein the plurality of first alignment marks and the plurality of second alignment marks comprise a fluorescence material;
wherein the plurality of first alignment marks and the plurality of second alignment marks together configure a first set of alignment marks.
|