US 11,756,872 B2
Package structure and manufacturing method thereof
Sung-Yueh Wu, Chiayi County (TW); Chien-Ling Hwang, Hsinchu (TW); Jen-Chun Liao, Taipei (TW); Ching-Hua Hsieh, Hsinchu (TW); Pei-Hsuan Lee, Tainan (TW); and Chia-Hung Liu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 11, 2021, as Appl. No. 17/199,348.
Prior Publication US 2022/0293505 A1, Sep. 15, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a carrier substrate having a first surface and a second surface opposite to the first surface, wherein the carrier substrate comprises an insulating body and through carrier vias (TCV) embedded in the insulating body;
a die disposed over the first surface of the carrier substrate, wherein the die has an active surface and a rear surface opposite to the active surface, the die has conductive posts formed on the active surface, the active surface faces away from the insulating body, and the die is electrically connected to the TCVs; and
a first redistribution structure disposed on the second surface of the carrier substrate.