CPC H01L 23/485 (2013.01) [H05K 1/114 (2013.01); H05K 1/115 (2013.01); H05K 3/303 (2013.01); H05K 3/421 (2013.01); H05K 2201/09609 (2013.01)] | 24 Claims |
1. An electronic device, comprising:
a substrate, having a plurality of first vias; and
at least one outer layer, having a plurality of second vias,
wherein the at least one outer layer is disposed on a side of the substrate,
wherein the plurality of first vias has a larger distribution density or quantity than the plurality of second vias, so that a part of the first vias are electrically connected to the plurality of second vias, and another part of the first vias are electrically floating.
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