US 11,756,865 B2
Electronic device having substrate
Sheng-Che Hung, Hsinchu County (TW); Shih-Hsien Wu, Taoyuan (TW); and Yu-Wei Huang, Chiayi (TW)
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed by INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed on Jan. 4, 2021, as Appl. No. 17/141,035.
Claims priority of provisional application 62/978,167, filed on Feb. 18, 2020.
Claims priority of application No. 109129162 (TW), filed on Aug. 26, 2020.
Prior Publication US 2021/0257279 A1, Aug. 19, 2021
Int. Cl. H01L 23/485 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 3/42 (2006.01)
CPC H01L 23/485 (2013.01) [H05K 1/114 (2013.01); H05K 1/115 (2013.01); H05K 3/303 (2013.01); H05K 3/421 (2013.01); H05K 2201/09609 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate, having a plurality of first vias; and
at least one outer layer, having a plurality of second vias,
wherein the at least one outer layer is disposed on a side of the substrate,
wherein the plurality of first vias has a larger distribution density or quantity than the plurality of second vias, so that a part of the first vias are electrically connected to the plurality of second vias, and another part of the first vias are electrically floating.