CPC H01L 23/36 (2013.01) [H01L 23/04 (2013.01); H05K 7/20218 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a substrate;
a semiconductor package disposed on the substrate;
a plurality of pillars disposed on the semiconductor package;
a lid disposed on the substrate and covering the semiconductor package and the plurality of pillars, the lid comprising an inflow channel and an outflow channel to allow a coolant to flow into and out of a space between the substrate, the semiconductor package, the plurality of pillars and the lid; and
a seed layer disposed between the plurality of pillars and the semiconductor package, wherein the semiconductor package is isolated from the coolant through the seed layer.
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