CPC H01L 23/3135 (2013.01) [H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H05K 1/147 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10128 (2013.01)] | 20 Claims |
1. A chip on film package, comprising:
a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface;
a plurality of wirings extending in a second direction toward the chip mounting region;
a semiconductor chip mounted in the chip mounting region on the first surface of the flexible base film and electrically connected to the plurality of wirings;
a pair of first heat dissipation members on the first surface of the flexible base film and spaced apart from the semiconductor chip, and extending in a first direction perpendicular to the second direction; and
a second heat dissipation member on the first surface of the flexible base film and covering the semiconductor chip and the pair of first heat dissipation members,
wherein the second heat dissipation member contacts the first surface of the flexible base film to completely fill a space between the semiconductor chip and the pair of first heat dissipation members, and
wherein each first heat dissipation member of the pair of first heat dissipation members has a width in the first direction and a width in the second direction, and the width in the first direction is greater than the width in the second direction.
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