US 11,756,811 B2
Pick and place machine cleaning system and method
Alan E. Humphrey, Reno, NV (US); Bret A. Humphrey, Reno, NV (US); Jerry J. Broz, Longmont, CO (US); and Wayne C. Smith, Reno, NV (US)
Assigned to International Test Solutions, LLC, Reno, NV (US)
Filed by International Test Solutions, Inc., Reno, NV (US)
Filed on Jul. 2, 2019, as Appl. No. 16/460,929.
Prior Publication US 2021/0005483 A1, Jan. 7, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); B65G 47/91 (2006.01); B08B 1/02 (2006.01); B08B 7/00 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67144 (2013.01) [B08B 1/02 (2013.01); B08B 7/0028 (2013.01); B65G 47/91 (2013.01); H01L 21/6838 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a semiconductor device handling machine having a pick and place apparatus, the pick and place apparatus having a contact element with an inner surface and an outer surface and the contact element contacts and picks one of a device and a component using suction;
a cleaning material attached to a substrate that is positioned adjacent to the pick and place apparatus, the cleaning material having a top layer that is contacted by the contact element of the pick and place apparatus during a cleaning process wherein the top layer has a plurality of microfeatures having a spacing between the microfeatures, a moment of inertia of each microfeature and a total length of each microfeature determined based on at least a diameter of the contact element of the pick and place apparatus that cleans an inside and outside surface of the contact element and a textured surface that cleans the inside and outside surface of the contact element; and
wherein the contact element is cleaned while the contact element is attached to the pick and place apparatus by inserting an end of the contact element into the cleaning material; and
wherein the pick and place apparatus performs the pick and place operation once the contact element is cleaned.