US 11,756,734 B2
Multilayer ceramic electronic component
Yong Jin Yun, Suwon-si (KR); So Ra Kang, Suwon-si (KR); Ki Pyo Hong, Suwon-si (KR); Byeong Gyu Park, Suwon-si (KR); Jong Ho Lee, Suwon-si (KR); and Jung Min Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 18, 2021, as Appl. No. 17/529,870.
Application 17/529,870 is a continuation of application No. 16/864,754, filed on May 1, 2020, granted, now 11,227,720.
Claims priority of application No. 10-2019-0086246 (KR), filed on Jul. 17, 2019.
Prior Publication US 2022/0076889 A1, Mar. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/232 (2006.01); H01G 4/224 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/232 (2013.01) [H01G 4/1227 (2013.01); H01G 4/224 (2013.01); H01G 4/30 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a body, including
a dielectric layer,
first and second internal electrodes,
a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and
a coating layer disposed on the first to sixth surfaces of the stacked portion and having
first and second connection portions extending to the first and second internal electrodes, respectively; and
first and second external electrodes respectively arranged on the third and fourth surfaces of the body and connected to the first and second internal electrodes, respectively through the first and second connection portions,
wherein the first and second internal electrodes and the first and second external electrodes are in contact with the first and second connection portions, respectively.